Abstract: For improving self-heating effects (SHEs) in gate-all-around metal-oxide-semiconductor field-effect transistors (GAA MOSFETs), hetero-gate-dielectric (HGD) is utilized. The HGD consists of ...
Abstract: 3D integration by TSV approach is a very hot topic now as an enabling technology for 3D wafer-level packaging and 3D IC. Re-distribution layer (RDL) process becomes more critical on high ...
A research team synthesized and determined the structure of a borate-linked 3D crystalline covalent organic framework, ...
The shape of biological structures, ranging from flower petals to the limbs or organs of animals, is often naturally best ...
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Blame the model, not the machine—better data helps 3D-printed metamaterials match predictions
Additive manufacturing, such as 3D printing, provides an excellent opportunity to design metamaterials: materials with an ...
Alignment accuracy, surface preparation, and process control are key factors in bringing hybrid bonding into semiconductor ...
Michael Zhdanov, a Distinguished Professor and Director of CEMI at the University of Utah, outlines the potential of Glass Earth® technology in improving geological interpretation, leading to better ...
Voro Therapeutics and Alloy Therapeutics have formed a strategic research partnership to develop tumour-selective, next-generation masked T-cell engager (TCE) therapeutics. The partnership will bring ...
Research Institute for Innovation in Sustainable Chemistry, National Institute of Advanced Industrial Science and Technology (AIST), Onogawa 16-1, Tsukuba 305-8569, Japan Article Views are the COUNTER ...
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